ASE Technology Holding Co.
Ltd. (NYSE:ASX) is one of the best tech stocks to buy for the next 5 years
On May 26, ASE announced the development of an industry-first automated 310mm x 310mm panel-level packaging production line, expected to enter production in early 2027. By transitioning from round wafers to larger rectangular panels, the process significantly increases usable surface area, enabling higher throughput and improved material efficiency for complex HPC and AI architectures. This innovation supports the industry’s shift toward trillion-transistor system-in-package designs by allowing for greater integration density and more dies per unit.
The platform is compatible with ASE’s existing FOCoS and FOCoS-Bridge technologies, ensuring design consistency while addressing the scaling limitations and manufacturing inefficiencies of traditional wafer-level processes. Photo from AAOI Designed for AI accelerators, HPC, and edge computing, this scalable platform aims to reduce cycle times and manufacturing costs. By optimizing interconnects and packaging efficiency, ASE Technology Holding Co.