ASE Technology Teams With WUS To Build Taiwan AI Packaging Plant

The collaboration aims to expand advanced semiconductor packaging capacity for AI and cloud computing demand. ASE Technology Holding Co. (ASX) and WUS Printed Circuit Co. will jointly construct a manufacturing facility in Kaohsiung’s Nanzih Technology Industrial Park. The

The collaboration aims to expand advanced semiconductor packaging capacity for AI and cloud computing demand.

ASE Technology Holding Co. (ASX) and WUS Printed Circuit Co. will jointly construct a manufacturing facility in Kaohsiung’s Nanzih Technology Industrial Park. The plant will focus on advanced packaging technologies, including FOCoS and FCBGA, targeting AI, cloud computing, and autonomous driving markets.

ASE reported Q1 2026 net revenues of NT$173,662 million, a 17.2% year-over-year increase but a 2.4% sequential decline. Net income rose to NT$14,148 million from NT$7,554 million in Q1 2025 but fell from NT$14,713 million in Q4 2025.

The partnership reinforces Taiwan’s role in the global semiconductor supply chain amid rising demand for high-performance computing solutions.

Leave a Reply

Your email address will not be published. Required fields are marked *