SK hynix Inc. (OTC:HXSCL) is one of the fastest-growing high-bandwidth memory stocks to buy.
The company gave the list one of its most direct HBM catalysts on June 17, 2026, when it shipped samples of 12-layer HBM4E to major customers
SK hynix said the next-generation AI memory reaches up to 16 Gbps per pin, improves power efficiency by more than 20% over previous models, and reduces data transfer latency through a new interface and design optimizations. The product also uses Advanced MR-MUF technology to reach 48GB capacity in a 12-layer stack, while cutting heat resistance by 17% compared with HBM4. Those details are important because HBM demand is increasingly tied not just to capacity but also to thermal stability and efficiency within dense AI data-center systems.
SK hynix is already one of the leading HBM suppliers, and the sample shipment keeps the company positioned close to the next memory node for AI accelerators. The update builds on SK hynix’s Q1 2026 results, when revenue rose 198.1% year over year to 52.57 trillion won, driven by strong AI demand and higher sales of high-value memory products. That combination keeps SK hynix among the clearest direct beneficiaries of the HBM upgrade cycle.