The investment aims to bolster AI hardware production and expand partnerships with TSMC and other Taiwanese suppliers through 2029.
Advanced Micro Devices will invest more than $10 billion in Taiwan to develop advanced chip packaging, substrates, and AI manufacturing capacity. The funding, spread through 2029, targets scaling production for next-generation products like Helios AI racks amid rising demand.
AMD’s move follows its use of TSMC’s 2-nanometer process and advanced packaging technologies for AI and data center chips. The company is also diversifying suppliers, collaborating with ASE Technology and Siliconware Precision Industries on next-gen packaging solutions.
The investment underscores AMD’s push to secure supply chain resilience and meet growing AI infrastructure needs without relying solely on TSMC.