The semiconductor firm seeks up to $80 billion in debt to fund AI infrastructure expansion, targeting senior and junior tranches.
Broadcom is in talks with lenders to secure $70 billion to $80 billion in debt for an AI chip financing arrangement. The deal may include a $45 billion senior tranche and a $35 billion junior tranche, though figures remain fluid.
The proposed financing mirrors a prior $35 billion deal and could total up to $100 billion under revised terms. Blackstone and Apollo Global Management are among potential investors, though neither firm has confirmed participation.
The funds aim to expand computing infrastructure for AI firms like Anthropic, targeting over 20 gigawatts of capacity by 2028. Broadcom’s custom chips and networking solutions underpin the initiative.