The multi-year deal aims to produce 15 billion chips domestically, supporting U.S. manufacturing and jobs.
Apple will invest over $30 billion in Broadcom to develop custom silicon and wireless components for its devices. The agreement spans multiple years and targets U.S.-based production, with plans to manufacture 15 billion chips domestically.
The deal is Apple’s largest under its American Manufacturing Program, launched in 2025. Broadcom will allocate $1.5 billion to expand its Fort Collins, Colorado facility, focusing on radio frequency components and wireless technologies.
Apple CEO Tim Cook highlighted the partnership’s role in advancing U.S. innovation, while Broadcom’s CEO credited the funding for enabling expansion in Colorado. The arrangement is expected to sustain hundreds of American jobs.