Deal includes production of over 15 billion chips in the US and a $1.5 billion facility upgrade in Colorado.
Apple and Broadcom signed a multiyear agreement valued at more than $30 billion to develop custom silicon and wireless components for Apple devices. The partnership extends through 2031 and supports Apple’s American Manufacturing Program, aiming to produce over 15 billion chips domestically.
Broadcom will invest $1.5 billion to modernize its Fort Collins, Colorado, manufacturing site. The deal follows a June 6 SEC filing outlining the multiyear collaboration, reinforcing Apple’s push to expand US-based production with key suppliers.
Apple CEO Tim Cook highlighted the deal’s role in advancing performance and connectivity while deepening investments in US innovation. Other AMP participants include Corning, GlobalFoundries, and Texas Instruments.